Fraunhofer IZM is putting the electric car in the fast lane
Skeptics of electromobility have raised critical questions, such as how fast an electric - car can be driven and the maximum distances it can... [mehr]
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Panel Level Packaging Consortium Moving to the Next Level
The Fraunhofer Institute of Reliability and Microintegration IZM is a renowned expert for wafer-level packaging and substrate technologies. This... [mehr]
Making small intestine endoscopy faster with a pill-sized high-tech camera
2001 the first endoscopic capsule took its journey through the small intestine of a human patient. With its miniature camera, the capsule captured... [mehr]
More reliable operation offshore wind farms
Wind-swept, wet, freezing cold or blazing hot – Wind turbines have to withstand the most extreme climatic conditions on a daily basis,... [mehr]
Cost-effective and individualized advanced electronic packaging in small batches now available
Research always means trying things out and daring to do new things. Research institutes, universities, and SMEs do not produce in large batches,... [mehr]
What really happens on the assembly line? High-precision localization promises more transparency!
Anybody who has ever used a screwdriver knows: The end result depends on the right angle of attack and the right torque. This applies even more... [mehr]
DISCO CORPORATION and Fraunhofer IZM-ASSID introduce new Laser Grooving
At Semicon Japan, Fraunhofer IZM, Germany and DISCO CORPORATION, Japan have agreed to collaborate in the field of laser processing. The worldwide... [mehr]